Bambu Lab PC
Bambu Lab PC
PC filament delivers high-strength, heat-resistant parts up to 117 °C with excellent impact strength for engineering applications. Bambu Lab PC runs at 260–280 °C with RFID auto-settings for AMS systems and maintains a precise 1.75 mm diameter (±0.03 mm) for smooth extrusion. Must be dried at 80 °C for 8 hours before printing and requires an enclosed printer for best results.
Key Features
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High heat resistance up to 117 °C for automotive and electronic parts
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Engineering-grade strength with 60 MPa tensile strength and excellent impact resistance
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RFID-enabled AMS compatibility for automatic material detection and setup
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Precise filament tolerance (1.75 mm ±0.03 mm) ensures consistent flow and dimensional accuracy
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Requires enclosed printer and proper drying (80 °C, 8h) for optimal print quality
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Compatible with textured PEI plates at 90–110 °C bed temperature with glue stick
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Professional transparency available in clear, white, and black colors for varied applications
Excellent Mechanical Properties: Precision in Every Layer
Bambu Lab PC delivers exceptional mechanical properties with precision-engineered layers, providing the strength and thermal stability needed for demanding engineering applications.
Exceptional Thermal Resistance: Defying High Temperatures
Bambu Lab PC withstands extreme temperatures up to 140°C with exceptional thermal resistance, making it perfect for high-heat automotive parts, electrical housings, and industrial components that demand superior heat endurance.
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System). Load and print! No more tedious setting steps.
