PC filament delivers high-strength, heat-resistant parts up to 117 °C with excellent impact strength for engineering applications. Bambu Lab PC runs at 260–280 °C with RFID auto-settings for AMS systems and maintains a precise 1.75 mm diameter (±0.03 mm) for smooth extrusion. Must be dried at 80 °C for 8 hours before printing and requires an enclosed printer for best results.

Key Features

• High heat resistance up to 117 °C for automotive and electronic parts

• Engineering-grade strength with 60 MPa tensile strength and excellent impact resistance

• RFID-enabled AMS compatibility for automatic material detection and setup

• Precise filament tolerance (1.75 mm ±0.03 mm) ensures consistent flow and dimensional accuracy

• Requires enclosed printer and proper drying (80 °C, 8h) for optimal print quality

• Compatible with textured PEI plates at 90–110 °C bed temperature with glue stick

• Professional transparency available in clear, white, and black colors for varied applications